Bambu Lab

Bambu High Temperature Plate (PEI)

€26,99 EUR

VAT excluded. Actual tax rate varies by country

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Things to know before use

 

  • Variations in the color and luster of the Engineering Plate appearance and the removal of the exposed metal areas are just minor adjustments to optimize the production process and surface quality. If the coating remains on the nozzle when the nozzle is wiped, it will be heated and melted before printing the model. Such changes do not affect leveling, Lidar, adhesion, or range of use. You can purchase with confidence!

  • Before auto-leveling, it is necessary to repeatedly rub the nozzle in the special wiping area of the build plate to completely remove any residual material at the tip of the nozzle. The coating in the special-designed wiping area will gradually become worn over time. This is normal and does not affect print quality or nozzle lifetime, so there is no need to worry about any quality issues.

  • Bambu Lab recommends only using Bambu Lab official glue on the Cool Plate, and can not be held responsible for any damage caused to plates as a result of using third-party glue on build plates.
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    Bambu High Temperature Plate (PEI) Bambu High Temperature Plate (PEI)

    Bambu High Temperature Plate (PEI) Bambu High Temperature Plate (PEI)

    Overview

     

  • The Bambu High-Temperature Plate is a sticker that is applied to the Bambu Engineering Plate which can be used on both sides. This is a consumable printing surface that is used in conjunction with a thin coat of glue stick and works well with most common filaments and scenarios.

  • The Bambu High-Temperature Plate leaves a smooth finish to the model that comes in contact with the High-Temperature Plate, and might require a bit of post-processing for cleaning up the glue stick.
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    Recommended Settings for Bambu High-Temperature Plate

    Please note that other slicer settings might need to be adjusted based on the printed model and the filament requirements

    Hotbed Temperature Glue Stick Required? Upper Glass Cover Plate Removed?
    PLA/PLA-CF/PLA-GF 45~60℃ Recommended Yes
    ABS 90~100℃ Recommended No
    PETG 80℃ Yes Yes
    TPU 35℃ Recommended Yes
    ASA 90~100℃ Recommended No
    PVA 45~60℃ Recommended Yes
    PC/PC-CF 100~110℃ Yes No
    PA/PA-CF/PAHT-CF 100~110℃ Yes No

    Benefits

    Works best with most 3D printing filaments

    Works well with the Automatic Calibration for Flow rate and does not interfere with the LIDAR

    Smooth texture on the surface of the print

    Excellent adhesion and easy print removal

    Can be replaced by the user

    Downsides

    It cannot be used without heating the printing surface

    Can be more fragile compared to the Engineering Plate or Textured PEI Plate

    The upper glass cover plate, or the front glass door need to be opened for filaments with a low glass transition temperature



    Recommended Settings for Bambu Engineering Plate

    Please note that other slicer settings might need to be adjusted based on the printed model and the filament requirements

    Hotbed Temperature Glue Stick Required? Upper Glass Cover Plate Removed?
    TPU 30~35℃ Recommended No
    PETG 70~80℃ Recommended Yes
    ABS 100~110℃ Yes No
    PC/PC-CF 100~110℃ Yes No
    PA/PA-CF/PATH-CF 100~110℃ Yes No

    Installation Steps

    Step 1: Align the plate with the fixed points of the platform with the name of the plate facing you Step 1: Align the plate with the fixed points of the platform with the name of the plate facing you

    Step 1: Align the plate with the fixed points of the platform with the name of the plate facing you

    Step 2: Lower the plate and secure to the magnetic platform Step 2: Lower the plate and secure to the magnetic platform

    Step 2: Lower the plate and secure to the magnetic platform


    Product Specification

    Surface temperature resistance Up to 200℃ Usable print size 256*256 mm
    Flexible spring steel thickness 0.5 mm Cool Plate sticker thickness 0.3 mm
    Package Weight 320 g Package size 290*290*4 mm